SERVICES

Printed Circuits Assembly Corporation is a contract electronics manufacturer of simple to highly-complex boards. Our versatility of services and expertise allows us to serve all types of clients – from medical, technical, and aerospace, to personal innovation projects. We build for prototypes with a quantity as low as one, to large scale production runs.  

We don’t just build boards; our experienced team can provide insight and feedback for improvements to your product, efficiency, and cost.

• 30+ yrs experience in Rapid Prototyping & NPI
• Quantities as low as one
• From simple to complex designs
• Quick turnarounds
• Very flexible to the unique and challenging issues including last-minute design and part changes

• Expert feedback to improve production and manufacturability of your design
  • Recommendations to make manufacturing easier in the long run
    (Ex. footprint and part spacing changes)
  • Bill of Material (BOM) review
  • X-Ray

• Leaded or lead-free (RoHS Compliant)
  water-soluble solder paste available
• Leaded or lead-free (RoHS Compliant) 
  no-clean solder paste available
• Max working area is 18x18 inches
• SMT down to 0201
• BGA, FPGA, CSP, LGA, QFN, fine pitch connectors, BGA SEAM connectors, etc.

• 15 State of the art solder paste printing machines
• 3 Reflow ovens with 8 heating zones to ensure smooth and even reflow
• Experience in rigid, flex, and metal-core PCB assembly
• Advanced wash system

• Wave solder, selective solder for mixed technology, and hand solder available
• Leaded or lead-free (RoHS Compliant) 
  no-clean solder wire available
• Component prep and lead-forming equipment
• Press-fit connectors* 

• Rework & repair services available
• Ace KISS-102 Selective Solder
• 3 Vitronics Soltec Wave Solder Machines
• Separate wave solder machines for leaded and lead-free assemblies to prevent cross-contamination

• PCB modifications such as cuts, jumpers,
  and part replacement
• Experience in replacing BGA (down to 0.4 pitch) FPGA, CSP (Chip Scale Package), QFN, LGA, Connectors, and other fine-pitch parts
• X-ray check after replacement of fine-pitch parts like BGA and QFN

• 3 APE “Sniper” Rework stations – 
  Various sizes of nozzles to heat up a specific part/area of the board during part replacement.
• Hot air rework stations
• BGA Underfill capabilities available

• Non-destructive X-ray helps to uncover hidden issues not visible to the naked eye or microscope
• 2 X-ray machines available
• 2D X-ray support to check for shorts
• Multiple viewing angles available

• Same day X-ray support available.
  You can even come by and
  watch the X-ray with one of our technicians!
• Save and send X-ray image captures available

• Customized to mask connector openings,
  switches, tooling holes, and other special parts
• Single-side or double-sided boards

• Chemtronics Konform SR silicone-based conformal coating stocked and available
• For other types, please inquire

• Capacitor and resistor values checked
  with Smart Tweezer equipment to ensure
  correct value is supplied by vendor

• Shortage check against Bill of Materials (BOM)